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📋 Filing Types Available on ForgeUp Filings Sourced from BSE corporate announcements (equity segment). Companies covered are BSE-listed and most are also listed on NSE. We show only material filings.
Financial Results Orders Dividend Buyback Merger / Acquisition Board Meeting Outcome Fundraise (QIP / Rights / FPO) Regulatory / Court Order Credit Rating Change Promoter Pledge Update Management Change Joint Venture / MOU Delisting Bonus Shares Stock Split
Data sourced from BSE India corporate announcements. More categories will be added over time.
Paras Defence and Space Technologies Ltd

Paras Defence Signs MoU for Rs. 6,200 Crore OSAT Facility in MP

JV / MOU ▲ Positive Development MEDIUM RISK
📅 Filed on BSE: 22 Jul 2026, 09:11 AM IST  ·  BSE ID: d9d17eef-6113-4311-a7ea-c2b952b4700a
View Original BSE Filing (PDF)
💡
In Simple Terms
Paras Defence will partner with the Madhya Pradesh government to build a large semiconductor chip assembly and testing factory in the state.
🤖 AI Summary
  • Paras Defence subsidiary to set up Rs. 6,200 Crores advanced IC packaging OSAT facility in MP.
  • MoU signed with MP State Electronics Development Corporation (MPSeDC).
  • Facility in Indore-Ujjain to undertake 3D heterogeneous integration and chiplet operations.
  • Proposed investment of approximately Rs. 6,200 Crores for the greenfield project.
🔢 Key Numbers — exact figures from BSE filing, not rounded
Proposed Investment
Rs. 6,200 Crores
Facility Location
Indore-Ujjain, Madhya Pradesh
🏢 How This Affects the Company
📈
Business Impact
This MoU signifies a strategic move into the advanced semiconductor packaging sector, potentially expanding Paras Defence's service offerings and market reach in a critical technology area.
💰
Financial Impact
The proposed investment of approximately Rs. 6,200 Crores outlines a significant capital expenditure commitment, impacting the company's future financial planning and funding requirements.
⚙️
Operational Impact
Establishing a greenfield OSAT facility will require substantial development, infrastructure setup, and specialized workforce recruitment, fundamentally altering operational scale and complexity.
⚠️
Risk Impact
This venture introduces new operational and execution risks associated with large-scale greenfield projects in a technologically advanced sector. Project execution and timely investment are key.
👥 What This Means For Shareholders
✅
Action Required
No immediate action is required from shareholders regarding this MoU.
👤
Who Is Affected
All shareholders are potentially affected by the company's strategic diversification into the semiconductor OSAT sector.
🔍
Management Signal
This signals management's intent to invest substantially in advanced manufacturing capabilities and explore new growth avenues in the electronics ecosystem.

For information only. Not investment advice. ForgeUp is not SEBI-registered.

👁 Watch List — track these upcoming events
Confirmation of definitive agreements for the OSAT facility.
Updates on project timelines and funding for the Rs. 6,200 Crores investment.
Details on key technology partnerships for advanced packaging operations.
MEDIUM RISK Large-scale greenfield project, significant capital, and execution complexity in a new sector introduce considerable risks.
💡 Investor Takeaway
Paras Defence's subsidiary signed an MoU to establish a Rs. 6,200 Crores advanced IC packaging OSAT facility in Madhya Pradesh, covering operations like 3D integration and chiplet assembly.
⚖️ Strengths & Concerns

✅ Positives

  • Significant proposed investment of Rs. 6,200 Crores into a greenfield advanced IC packaging facility.
  • Collaboration with MP State Electronics Development Corporation for facility establishment in Madhya Pradesh.
📅 Company Track Record
Paras Defence previously signed an MoU with Complus Systems and JV Micronics for an anechoic chamber consortium, indicating a pattern of strategic partnerships in technology sectors.

Based on publicly available historical data. For context only.

❓ Frequently Asked Questions
What is the proposed investment for the advanced IC packaging OSAT facility?
The proposed investment for the greenfield advanced IC packaging OSAT facility in Madhya Pradesh is approximately Rs. 6,200 Crores.
Which entities signed the Memorandum of Understanding (MoU)?
Paras Semiconductors Private Limited, a subsidiary of Paras Defence and Space Technologies Limited, signed the MoU with MP State Electronics Development Corporation (MPSeDC).
Where will the advanced IC packaging OSAT facility be located?
The facility will be located in the Indore-Ujjain region of Madhya Pradesh.
What types of advanced packaging operations will the facility undertake?
The facility will undertake operations including 3D heterogeneous integration, 2.5D/3D advanced packaging, hybrid bonding, fan-out packaging, chiplet integration, wafer bumping, and testing.

Questions based on this BSE filing only. For information purposes.

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⚠️ For Information Only — Not Investment Advice
ForgeUp Filings provides AI-generated summaries of public BSE exchange announcements (equity segment) for informational purposes only. Nothing here constitutes investment advice or a recommendation to buy, sell, or hold any security. ForgeUp is not a SEBI-registered investment advisor. All financial numbers are sourced directly from BSE filings and shown as-is. Past data is historical only. Please consult a qualified financial advisor before making investment decisions. Data sourced from BSE India public disclosures.
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